1、Information Classification:GeneralInformation Classification:GeneralFor Manufacturing of Optical CoatingsFHR Coating Equipment CIOE conference,ShenzhenSeptember 7th,2023Ronny KleinhempelInformation Classification:GeneralAgenda Short company presentation Introduction of FHR.Star platform High precisi
2、on coating equipment FHR.Star.EOSS FHR ALD coater concepts-CONFIDENTIAL-Information Classification:GeneralInformation Classification:GeneralCompany Presentation-CONFIDENTIAL-Information Classification:GeneralFHR product seriesFreely configurable process modules for PVD,PECVD,ALD,RIE,IBE,plasma clean
3、ingFHR.Star product seriesFHR.Boxx product seriesFHR.Line product seriesFHR.Roll product series-CONFIDENTIAL-Information Classification:GeneralCoating materials and sputtering targetsCylindrical and planar sputtering targetsSputtering targets&bonding servicesProduction and development of coating mat
4、erialsDebonding old sputtering targetsBonding new sputtering targetsConsultation on the optimal design,development and production of heat sinks and back platesRecycling valuable materials or disposing of residual materialsLarge volume or individual pieces-CONFIDENTIAL-Information Classification:Gene
5、ralFHR.Star seriesCoating Equipment for optical applications:Catalogue optics:Medical/biosciences(Fluorescence microscopy)Filters(notch,edge,)Beam-splitterLaser optics(medical,manufacturing etc)NIR bandpass filters for 3D sensing:Face recognition for user-machine interactions LIDAR as key technology
6、 for autonomous drivingDWDM/CWDM filtersTelecommunication Semiconductor wafer-level processing-CONFIDENTIAL-Information Classification:GeneralFHR.Star seriesModular Clustertype Coating EquipmentConcept Overview-CONFIDENTIAL-Information Classification:GeneralFHR.Star seriesSingle process chambersConc
7、ept OverviewCo-sputtering chambersTurntable-CONFIDENTIAL-Modular Clustertype Coating EquipmentInformation Classification:GeneralFHR.Star.75/100-PentaCo for 4/6 wafer-processingCompact deposition tool with single-substrate or magazine load lockprocess chamber with up to 5 confocal sources 75/100mmCon
8、cepts with up to 6 chambers possible-CONFIDENTIAL-Information Classification:GeneralFHR.Star.150-Co for 8 wafer-processingDeposition tool with magazine load lock,handling module,high/low temp.process chambers,each with 3 confocal 150 mm sources-CONFIDENTIAL-Information Classification:GeneralFHR.Star
9、.300For 100-200mm/4-8 inch waferUp to 6 process modules for sputtering(300mm targets),evaporation,PECVD2 magazine load lock chambersPlasma pre-treatmentSubstrate rotationThickness uniformity 2%Co-sputtering modules can also be included Modular type system for stationary coating-CONFIDENTIAL-Informat
10、ion Classification:GeneralFHR.Star.220For 100mm and 150mm/4”and 6”waferUp to 5 sputter sourceswith 220mm circular targetsPlasma pre-treatmentAdditional optional modulesMagazine Load lockStatic deposition(6 substrates on turntable)Dynamic deposition(12 substrates on turntable)Thickness uniformity 2%C
11、luster type system with turntable for 4“or 6“substrates-CONFIDENTIAL-Information Classification:GeneralFHR.Star.200Up to 30 substrates(100mm/4inch wafer)Up to 5 sputter sourceswith 200mm circular targetsPlasma pretreatmentSeparated load lock and coating chamberDynamic depositionThickness uniformity
12、2%Load lock type system with turntable for 30 substrates in mainchamber-CONFIDENTIAL-Information Classification:GeneralHigh Precision Coating EquipmentFHR.Star.500/600-EOSS Information Classification:GeneralHigh Precision Coating EquipmentFHR.Star.500/600-EOSS Information Classification:GeneralMachi
13、ne concept3 x dual rotatable magnetrons in sputter-up configuration1 x plasma source12 substrates(200 mm x 50 mm)Magazine load lock(20 places)Load and unload within 10 minTurntable speed up to 250 rpmSubstrate heatingIntegration of up to 4 process gasesOptional Broadband MonitoringFHR.Star.EOSS-seri
14、esFHR.Star.500-EOSS-CONFIDENTIAL-Information Classification:GeneralMachine conceptUp to 4 dual rotatable magnetronsin sputter-up configurationUp 2 plasma sources12 substrates(300 mm or 280 x 330 mm)Dual magazine load lock(2 x 15 places)Load and unload within 15 minTurntable speed up to 250 rpmSubstr
15、ate heatingIntegration of up to 4 process gasesOptional Broadband MonitoringFHR.Star.EOSS-seriesFHR.Star.600-EOSS-CONFIDENTIAL-Information Classification:GeneralAdvantages of FHR.Star.EOSSPrincipleYour request-Our solutionInformation Classification:General-CONFIDENTIAL-Requirements:Low particle&defe
16、ct contaminationLong term stability and durabilityHigh reproducibilityHigh uniformity,Low absorption,scattering,no pinholes,low adhesion failureSputter-up arrangementMoving parts(Shutter,rotary cathodes)below the substrateMagnetronsAdvantages of machine conceptFor optical applicationsInformation Cla
17、ssification:General-CONFIDENTIAL-Requirements:Low particle&defect contaminationLong term stability and durabilityHigh reproducibilityHigh uniformityLow absorption,scattering,no pinholes,low adhesion failureCylindrical rotarymagnetronsStable sputtering processConstant sputtering geometry,no race trac
18、s(compared to planar targets)Advantages of machine conceptFor optical applicationsInformation Classification:General-CONFIDENTIAL-Requirements:Low particle and defect contaminationLong term stability and durabilityHigh reproducibilityHigh uniformityLow absorption,scattering,no pinholes,low adhesion
19、failurerotary sputter sourcecylindrical target tube75%target yieldAdvantages of machine conceptFor optical applicationsSurface remains flatcylindrical shapeInformation Classification:General-CONFIDENTIAL-AutomatizationSoftware developed by FHRFHR softwareModular conceptSeparate control of all compon
20、entsBatch programs availableStable process controlClear process monitoringIntegration in production systemsCommunication to customer Enterprise Resource Planning(ERP)SystemCommunication to customer Manufacturing Execution System(MES)Information Classification:General-CONFIDENTIAL-AutomatizationSoftw
21、are developed by FHRFHR softwareModular conceptSeparate control of all componentsBatch programs availableStable process controlClear process monitoringIntegration in production systemsCommunication to customer Enterprise Resource Planning(ERP)SystemCommunication to customer Manufacturing Execution S
22、ystem(MES)Information Classification:GeneralOptical broadband monitoringFHR.Star.EOSSYour request-Our solutionInformation Classification:GeneralOptical MonitoringFHR.Star.EOSS-seriesFHR.Star.500-EOSSFull production automation by MOCCA+Broadband monitoring with optional in-situ correctionIn-situ meas
23、urement of transmission spectraSpectral range 360-1680 nmAccuracy 0.3 nm(10 years experienenceClose collaboration withFraunhofer IST,Braunschweig,GermanyDevelopment of FHR.Star.500-EOSS&FHR.Star.600-EOSS seriesFHR.Star.500-EOSSFHR Experience and CompetenceFirst Enhanced Optical Sputtering System“(EO
24、SS)at IST,2011Information Classification:GeneralHigher productivitySubstrate handling for different substrate types and geometriesRevolver typeSemi cassetteDual-column typeSingle substrate-CONFIDENTIAL-Information Classification:GeneralCarrier concept-CONFIDENTIAL-The carrier concept allows to use d
25、ifferent insets and gives highest flexibility with respect to jig geometry:Information Classification:GeneralDeposition Rate of FHR.Star.500-EOSSSiO2:0.45 nm/sa-SiH:0.40 nm/sPer compartmentStable processes with highest deposition rates up to:Ta2O5Nb2O5SiO2Hn1Nb2O5:0.50 nm/sTa2O5:0.40 nm/sAl2O3:0.75
26、nm/sa-Si:0.35 nm/s-FHR CONFIDENTIAL-Information Classification:GeneralAvailable Processes and materialsAl2O3 and Ta2O5 on Si WaferNon-Uniformity single layer 0.3%On 200 mm Si waferEllipsometer,edge exclusion 5 mmAl2O3Ta2O5-FHR CONFIDENTIAL-Information Classification:GeneralAvailable Processes and ma
27、terialsTa2O5 on Si WaferWafer-to-wafer non-uniformity 0.2%On 200 mm Si waferEllipsometer,edge exclusion 5 mm-FHR CONFIDENTIAL-Information Classification:GeneralFilter MeasurementBPF 940nm935-960nm Tavg 0 95.9%925-950nm Tavg 30 95.0%Spectral shift 11 nmWidth 41 nmSlope 10%-90%9.5 nmInformation Classi
28、fication:GeneralSpatial ALD Equipment FHR.Star.400 x300-SALDAtomic Layer Deposition(ALD)-CONFIDENTIAL-Information Classification:GeneralMerits Of ALDHarm Knoops,AtomicLimits image library(2020).A similar figure to this figure was published in:Harm Knoops,Atomic Layer Deposition in Handbook of Crysta
29、l Growth,DOI:10.1016/B978-0-444-63304-0.00027-5Atomic Layer Deposition(ALD)Merits of ALD FHR:ALD vs.PVD coatings-CONFIDENTIAL-Information Classification:GeneralAtomic Layer Deposition(ALD)ApplicationsSINGH,A.et al.Applied Physics Letters 103(2013),233302.Uniform insulatinglayer in trenches forCMOS d
30、evices Fraunhofer IOF(Jena,Germany)(https:/www.iof.fraunhofer.de/de/geschaeftsfelder/funktionale-oberflaechen-und-schichten/ALD-for-Optical-Coatings.html)Uniform optical layerstack on 3D objects FHR:100 nm wide trenchescoated uniformilyBarrier to protect sensitive devices(like OLEDs)againstmoisture-
31、CONFIDENTIAL-Information Classification:GeneralAtomic Layer Deposition(ALD)Surface conformal deposition-CONFIDENTIAL-Information Classification:GeneralSpatial ALDProductivity=f(coating space)Temporal ALDSpatial ALDInformation Classification:GeneralSpatial ALD equipmentFHR.Star.400 x300-SALDSubstrate
32、s:8 pcs.200 mm waferOR4 pcs.400 x 300 x 10 mm(textiles)Al2O3 process:up to 10 nm/min,1.5%on 200 mm wafersProcesses:Al2O3,TiO2,ZnO,Al:ZnO,SiO2,-CONFIDENTIAL-Information Classification:GeneralFHR Application LabCoating Service and Customer sampling can be done in the in-house coating lab Focus on high
33、 precision coating and process development-CONFIDENTIAL-Information Classification:GeneralSummaryWhat we provide for our customersFHR.Star series dedicated to the field of optical coating equipmentFHR provides a flexible machine platform for different requirementsSputteringEvaporation ALDWhat else?-CONFIDENTIAL-Information Classification:GeneralThank you for your Attention!Please come and visit our booth 1B01(Hall 1)Ronny KleinhempelTechnical Sales Manager Optics,Ronny.Kleinhempelfhr.de/+49 3 52 05-5 20-172
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