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1、SFF TA-1034Pluggable Multi-Purpose Module PMMAnant Thakar Cisco SystemsAgenda Preamble Why new Form Factor?Use Cases Electro-Mechanical Form Factor Connector Paradigm Shift in ComputingMemory TiersSCMComputational StorageCore ExplosionMemory/IO ScalingBW/Capacity limitationSmartNIC ComputingApplicat
2、ion Specific accelerationNetwork Service offload computing AI/ML WLComputer VisionCognitive Computing Accelerated ComputingGPU/TPU SW on SiliconFPGA/IPU/DPU Memory Tiers DRAM/SCM,Near Memory compute CPU CentricHeterogeneous ComputeHomogeneous ComputeKey Drivers ML/DL Workloads&disaggregation in Data
3、 Center Best of breed domain specific Hardware Leading to Modular server partition InterconnectWhy new Form Factor?Use cases1.sNIC/DPU compute/AcceleratorsTransition from foundation NIC to high power and high-performance network services including MegaNIC applications2.High TDP GPUs 200W-400W+Servic
4、eability and better thermal aspects 3.Memory Cassette -Multi-TB Capacity expansion(e.g x DIMMs with CXL controller)Transition from local dram DIMMs to capacity/Bandwidth expansion Tier 4.Modular Edge compute/Multi Node (CPU+DIMM+Front IO)Standardized Form factor for Edge compute/Multi node/SP market
5、CXL Memory ControllerEDSFF 4CCXL Memory CassetteDPUCPUWhat is a PMM?Working LZ:SFF-TA-1002 like(PCIe/CXL G5/G6/G7)Advanced sidebands USB,KX/KR,PESTI Data IO signal Pairs-2 x 16 Lanes Thermal/Power support up to 200W600W Thickness:can fit in 1U horizontal Length:DIMMs+other components driven Width:xP
6、U+8(min)DIMMs driven Height:QSFP 1T,2T DIMM driven Sponsors:Cisco/Intel/HPEPMM aka Pluggable Multi-Purpose Module defines Electromechanical definition of Module and Host side connector enabling new use cases and as such is new Form factor.PMM Module Mechanical 2T1T230mm125mm38.4mm18.3 mm230mm125mmLe
7、ngth:230mm(9”)including card edge.Carrier or latch will add length(separate)Would have mounting provisions 2T Thickness:38.4mm38.2 to 38.4mm still under discussionIf DIMMs,assumes open top(flush with top)1T Thickness:18.3mmWidth:125 mm125 mm needed to fit in Half width ORV3Power Envelope200W for 1T
8、12V+/-5%200-600W for 2T 12V+/-5%Thermal Base Assumption for air cooling 200W -20 CFM,Pressure 0.5 H20,Ta=35C400W-30 CFM,Pressure=0.75 H2O,Ta=35C600W may necessitate liquid cooling Air pass throughHost side Connector development and CompatibilityBased on SFF-TA-1002 4C(2 x 4C for x32 lanes)with extra
9、 power connector16/32 PCIe/CXL data lanes with advanced Side band Interface4C-A section adds additional x 16 supportCapable of 200W-600W delivered power after derating Enhancement to 4C+Power increased to 200W from 80W Redefined+section for advanced sidebandsSeparate 400W Power connectorFuture 54V r
10、eadyCompatible with E3+OCP NIC compatibility using interposer and additional sideband logic FPGA108 Pin 56P 28P 44P+PWR 28P200W400W4C-A4C+Power delivery Still under discussionHost side Connector OutlineConnector MechanicalSFF TA-1034 Committee Next StepsConnector mechanicals(will define in a separat
11、e spec to be created)MechanicalsModule DrawingsSystem implications(e.g.,insertion,extraction force,preload,EMI/ESD requirementsPin list/placement changes(as needed)Functional Details:BifurcationSideband consolidationElectrical RequirementsPower and sequencingInformative info on how to maintain compatibility with OCP NIC,EDSFF E3Clean up on all completed sections based on learnings Please Note lot of things are in draft stage and are subject to change