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1、3rd generation Open Edge Server designEdge3rd generation Open Edge Server designJari Ruohonen,Product Management Lead,Nokia3rd generation Open Edge Server designNokia and ASUS have jointly developed a new 3rd generation Open Edge server sled featuring support for 4th Generation Intel Xeon Scalable P
2、rocessors.This presentation highlights the main technical specifications of this server.The main enhancement is the introduction of support for PCIe gen5 and DDR5 technologies in addition of the new CPU generation.These improvements bring significant benefits in running various real-time application
3、s at the edge.Improved system cooling will enable simultaneous use of higher TDP CPUs and various accelerator cards.New server technology enhancements 4thgen Intel XEON scalable processor supportPlatform improvements in supporting real-time applicationsIncreased memory bus speed:DDR4 3200 MT/s-DDR5
4、4800 MT/sSupport for new PCIe generation:Gen4-Gen5Increased number of PCIe lanes:64-802U server advantagesEnables higher Processor TDP and performance3 PCIe slots for acceleratorsServer supports full PCIe x16 gen5 connectivity to each PCIe slotComputing performance increases comparing to required co
5、oling powerBenefits for Cloud RAN use caseCloud RAN vDUand vCUfunctions are hard real-time,latency critical and performance demanding applications with high power efficiency requirementsNew Open Edge server design provides excellent fit to those requirements:New processor architecture and increased
6、memory and PCIe bandwidths enables Cloud RAN processing for L2 and L3 layers done with lower amount of CPU cores2U server variant with high amount of PCIe device slots gives optimal balance between L1 inline acceleration with Cloud RAN SmartNICand general-purpose CPU resourcesWith bigger amount of P
7、CIe devices connectivity needs of cloud RAN deployment can be fulfilled3x Single cloud RAN server performance2x Capacity per used powerMechanical design 1U/2U Full Front Access,Tool-less serviceabilityModular Design Concept:Fan module,SSD module,Riser assembly,M.2 moduleFlexible Fan Module Design:Op
8、tions for front-to-rear/rear-to-front airflow directionModular Concept design both on 1U/2UTwo Airflow configurationHot swap module(EDSFFs)1U sled interfaces 123123467Front view of Open edge server sledRear view of Open edge server sledItemDescription1Power button(with identifier LED)22 x USB3.2 Gen
9、 1 connector3Mini DisplayPort connector4Switch Ethernet connector5Reset button6Mini-USB to UART debug interface7OCP v3.0 card8PCIe x16 card(Gen5 x16 link,FHHL)92 x EDSFF E1.S,NVMe,hot swapItemDescription1Fan module,front to rear&rear to front options2Backplane power connector3Backplane signal connec
10、tor5892U sled interfaces ItemDescription1Power button(with identifier LED)22 x USB3.2 Gen 1 connector3Mini DisplayPort connector4Switch Ethernet connector5Reset button6Mini-USB to UART debug interface7OCP v3.0 card81 x PCIe x16 card(Gen5 x16 link,FHHL)2 x PCIe x16 card(Gen5 x16 link,FHFL)96 x EDSFF
11、E1.S,NVMe,hot swap3Rear view of Open edge server sledFront view of Open edge server sledItemDescription1Fan module,front to rear&rear to front options2Backplane power connector3Backplane signal connectorNokia:https:/ Marketplace:https:/www.opencompute.org/productsProduct Info Join regular
12、 Open edge calls(under Telco project)Contribution will be available during 2nd half of 2023 Server product will be in OCP Marketplace by end of 2023 Where to buy(earlier generations):https:/www.opencompute.org/products Project Wiki with latest specification:https:/www.opencompute.org/wiki/Telcos/Edge Mailing list:https:/ocp-all.groups.io/g/OCP-EdgeCall to ActionThank you!