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1、OCP Global Summit October 18,2023|San Jose,CADr.Richard W.Bonner III,CTO,AccelsiusHigh-Heat-Flux Rack Level Direct-to-Chip Two-Phase Cooling Using Sustainable FluidsData centers consume 3%of electricity generated on Earth(2022)and 40%of that is used to cool1.2%of the electricity generated on Earth i
2、s used for data center cooling!Collectively,data centers are among the top-ten water-consuming industrial or commercial industries in the USChatGPT needs to“drink”a 500ml bottle of water for a simple conversation of roughly 20-50 questions and answersData Center Energy and Water DemandsPower Density
3、 and Energy BackdropDriving higher CPU/GPU power consumptionAs energy prices increase and become less predictableMore processing power is coming with less power efficiencyThermal Technology C(2022)4.5X to 9X less mass flow rate required when compared with single-phase waterNatural circulation using
4、gravity alone is possible for some usage casesSimilar or even lower thermal resistance than single-phase waterTwo-phase cooling does not need to rely solely on forcing flow through small channels for enhancement,benefiting from boiling and evaporationNo leakage concerns with dielectric fluidsBetter
5、thermal uniformity across the chip since bulk temperature is nearly constantFamiliar rack architecture(as compared with immersion)The Case for Two-Phase CoolingTwo-Phase Cooling with R1336mzz(Z)Extrapolating to Future PlatformsGlobal Warming Potential(GWP)R134a:1,300,R245:1,030,R1336mzz(Z):2,R1233zd
6、(E):1Material CompatibilityFlammabilityPressure ContainmentEffects Weight,Component Costs,Packaging,etc.Polyfluorolalkyl Substances(PFAS)Emerging Regulatory Issue,Especially in EuropeThermal PerformanceSingle-Phase Water versus Two-Phase RefrigerantLow GWP vs High GWP,etc.Refrigerant Working Fluid I
7、ssuesThe data center cooling problem presents several challenges,related to electricity and water demand,power density/thermal performance,and refrigerant sustainability and flammabilityDirect-to-chip two-phase cooling results to date appear capable of meeting these various challengestechnology is s
8、till in its infancy when compared to air and even direct-to-chip waterEmerging regulatory challenges,like PFAS,will drive the need for different fluidsLikely with tradeoffs such as inferior thermal properties,requiring even better evaporator designs than exist todaySummaryOCP Global Summit|October 18,2023|San Jose,CA