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1、OCP Global Summit October 18,2023|San Jose,CAHeterogenous Integration and Linear Optical EnginesRadha NagarajanSVP/CTO Cloud Optics Business GroupMarvellForward-looking statementsExcept for statements of historical fact,this presentation contains forward-looking statements(within the meaning of the
2、federal securities laws)including statements related to future revenue,future earnings,and the success of our product releases that involve risks and uncertainties.Words such as“anticipates,”“expects,”“intends,”“plans,”“projects,”“believes,”“seeks,”“estimates,”“can,”“may,”“will,”“would”and similar e
3、xpressions identify such forward-looking statements.These statements are not guarantees of results and should not be considered as an indication of future activity or future performance.Actual events or results may differ materially from those described in this presentation due to a number of risks
4、and uncertainties.For other factors that could cause Marvells results to vary from expectations,please see the risk factors identified in Marvells Quarterly Report on Form 10-Q for the fiscal quarter ended July 29,2023 as filed with the SEC on August 25,2023 and Marvells Annual Report on Form 10-K f
5、or the fiscal year ended January 28,2023 as filed with the SEC on March 9,2023,and other factors detailed from time to time in Marvells filings with the SEC.Marvell undertakes no obligation to revise or update publicly any forward-looking statements.Forward-looking statements20-year history of data
6、center pluggable modules1000 x increase in data rate,100 x improvement in energy efficiency200020252020201520102005Year0000Data rate(Gbit/s)Energy consumption(pJ/bit)Energy consumptionElectrical power(pW)Data rate(bits/s)=2023 Marvell.All rights reserved.4DSP,49%Optics+electronics,27%Tuna
7、ble laser,12%Power overhead,12%SerDesADC/DACFECModemASIC othersClient procDriverModulatorLaserTIAPCBDC/DCNominal power breakdown for a DSP based module5R.Nagarajan,et al.,Low Power DSP-Based Transceivers for Data Center Optical Fiber Communications,“J of Lightwave Technol.,39(16),2021.C.Fludger,“Per
8、formance Orientated DSP design for Flexible Coherent Transmission”,Th3E.1,Tutorial,OFC 2020,based on OIF2017.049.01.50%of the module power consumption is the coherent DSP This is generally also true for the 100G PAM4 IM/DD,DCI module.2023 Marvell.All rights reserved.Optical TransceiverDriver:Voltage
9、 amplifier:CMOS,SiGeTransimpedance amplifier:Convert current to voltage:CMOS,SiGe 2023 Marvell.All rights reserved.Photodetector:GeModulator:SiData InData OutLaserFiberHeterogeneous IntegrationChip-on-Wafer(on-Interposer)Chip-on-Wafer-on-Substrate2Dintegration2.5Dintegration3Dintegration 2023 Marvel
10、l.All rights reserved.Integration:Wirebondsto Vias 2023 Marvell.All rights reserved.Integration:TSV based 2.5D assembly TSV based 2.5D integration on silicon photonics Integration of silicon photonics interposer on high-speed substrate with DSP and other ASICs Design optimization of the whole system
11、 on substrate 2023 Marvell.All rights reserved.2.5D integration2D integrationIntegration:Via-Last Process 2023 Marvell.All rights reserved.Integration:Wafer Level AssemblyWafer level assemblyTIA,Driver&DFB laser flip chip on Silicon 2023 Marvell.All rights reserved.Analog,linear,light engineLight engine packaged with a DSPLPO module